Method of fabricating a printed circuit board and the PCB produc

Details Method of fabricating a printed circuit board and the PCB produc Method of fabricating a printed circuit board and the PCB produc

1988-05-24

1990-06-19

Hall, Carl E.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29830, 174263, 361414, H05K 336, H05K 100

Patent

active

049355848

ABSTRACT:
A circuit board is fabricated from first and second composite sheets, each composed of a substrate of dielectric material and at least one conductor run adhered to the substrate. The substrate of the second composite sheet is formed with a through hole adjacent to the conductor run of that sheet. The second composite sheet is adhered to the first composite sheet, with the conductor run of the first sheet exposed through the hole in the second sheet. Conductive material is introduced into the hole and provides an electrically-conductive connection between the conductor runs of the two sheets.

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patent: 4685033 (1987-08-01), Inoue
patent: 4721831 (1988-01-01), Vora
patent: 4763403 (1988-08-01), Klein et al.
patent: 4803450 (1989-02-01), Burgess et al.

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