Method of fabricating a printed circuit board

Details Method of fabricating a printed circuit board Method of fabricating a printed circuit board

1977-04-07

1978-08-22

Combs, E. M.

Metal working

Method of mechanical manufacture

Electrical device making

H05K 300

Patent

active

041078373

ABSTRACT:
A method of fabricating a printed circuit board is disclosed. The method comprises forming a metal substrate having a through-hole pattern. The metal substrate is coated with a dielectric powder having a suitable flow length value to form a dielectric coat on the substrate having a sufficient through-hole edge coverage. The dielectric coated substrate is then treated with a second powder to form a satisfactory topcoat thereon. Electrical circuitry is then formed on the topcoat in conjunction with the through hole pattern.

REFERENCES:
patent: 3140195 (1964-07-01), Nagel
patent: 3377699 (1968-04-01), Dinella et al.
patent: 3446642 (1969-05-01), Webb
patent: 3934334 (1976-01-01), Hanni
Western Electric Technical Digest, No. 19, Jul. 1970, p. 23.
Plating, Jan. 1974, pp. 47-52.

Affiliated with

Also associated with

Rating

Method of fabricating a printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1548878