Method of fabricating a printed circuit

Metal working – Method of mechanical manufacture – Electrical device making

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29830, 156219, 156220, H05K 302

Patent

active

060323574

ABSTRACT:
The present invention comprises a printed circuit having a three-dimensional surface capable of conforming to a contoured surface of a vehicle trim panel. Printed circuit comprises a plurality of electrical conductors and connectors secured to a polymeric substrate. A convoluted region of the printed circuit permits formation of the three-dimensional surface in the printed circuit. The present invention further comprises a method a producing three-dimensional surface and the printed circuit by either thermoforming the printed circuit or mechanically stretching the printed circuit to produce the three-dimensional surface.

REFERENCES:
patent: 3427715 (1969-02-01), Mika
patent: 4810917 (1989-03-01), Kumar et al.
patent: 4816836 (1989-03-01), Lalezari
patent: 4944087 (1990-07-01), Landi
patent: 5220488 (1993-06-01), Denes
Injection Molded thermoplastic Printed Circuit Boards by J. Travis et al, paper in 1.sup.st Intr SAMPE Electronics Conf. vol. 1, pp 668-680 (1987).
Molded circuit interconnects perform to specification by D.C. Friseh paper in Printed Circuit Design V6 n 11 Nov. 1989 pp 78-82.
"Single-and multilayer molded circuits using image decals in the molding Process" by Frank Wood et al paper in Electronic Manufacturing vol. 36 n 7 Jul. 1990 pp 24-27.

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