Method of fabricating a precision buried resistor

Semiconductor device manufacturing: process – Making passive device – Resistor

Reexamination Certificate

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C257S543000, C257SE27016

Reexamination Certificate

active

07910450

ABSTRACT:
The present invention provides a semiconductor structure including a buried resistor with improved control, in which the resistor is fabricated in a region of a semiconductor substrate beneath a well region that is also present in the substrate. In accordance with the present invention, the inventive structure includes a semiconductor substrate containing at least a well region; and a buried resistor located in a region of the semiconductor substrate that is beneath said well region. The present invention also provides a method of fabricating such a structure in which a deep ion implantation process is used to form the buried resistor and a shallower ion implantation process is used in forming the well region.

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Chinese Office Action dated Oct. 9, 2009.

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