Method of fabricating a power semiconductor module

Details Method of fabricating a power semiconductor module Method of fabricating a power semiconductor module

2007-07-26

2009-12-15

Lee, Hsien-ming (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S458000, C257SE25005

Reexamination Certificate

active

07632712

ABSTRACT:
A semiconductor module is disclosed. One embodiment provides a first electrically conductive carrier composed of a first material, a second electrically conductive carrier composed of the first material, an electrically insulating element composed of a second material, which connects the first carrier and the second carrier to one another, a first semiconductor substrate applied to the first carrier, a second semiconductor substrate applied to the second carrier, and an electrically conductive layer applied above the first carrier, the second carrier and the insulating element. The electrically conductive layer electrically conductively connects the first semiconductor substrate to the second semiconductor substrate.

REFERENCES:
patent: 5156999 (1992-10-01), Lee
patent: 5641944 (1997-06-01), Wieloch et al.
patent: 6411642 (2002-06-01), Mazed
patent: 7069645 (2006-07-01), Ishikawa et al.
patent: 2005/0260796 (2005-11-01), Takahashi
patent: 2006/0022326 (2006-02-01), Morita et al.
patent: 2006/0071238 (2006-04-01), Guerra et al.
patent: 2006/0145334 (2006-07-01), Tsukada et al.
patent: 2006/0263584 (2006-11-01), Schulz-Harder et al.
patent: 2007/0287265 (2007-12-01), Hatano et al.
patent: 2007/0296065 (2007-12-01), Yew et al.
patent: 69207410 (1994-03-01), None
patent: 4201910 (1995-05-01), None
patent: 4444680 (1996-06-01), None
patent: 3544324 (1997-09-01), None
patent: 19719648 (1998-11-01), None
patent: 10101086 (2001-07-01), None
patent: 102005047106 (2007-04-01), None
patent: 102007004005 (2007-10-01), None
patent: 0049791 (1982-04-01), None
patent: 2417824 (2006-08-01), None
patent: 59151437 (1984-08-01), None

Affiliated with

Also associated with

Rating

Method of fabricating a power semiconductor module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a power semiconductor module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a power semiconductor module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4139776