Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-05-13
2008-05-13
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S606000, C029S603240, C336S200000, C336S232000, C360S123090
Reexamination Certificate
active
09588788
ABSTRACT:
Within a method for fabricating an inductor structure there is first provided a substrate. There is then formed over the substrate a planar spiral conductor layer to form a planar spiral inductor, wherein a successive series of spirals within the planar spiral conductor layer is formed with a variation in at least one of: (1) a series of linewidths of the successive series of spirals; and (2) a series of spacings of the successive series of spirals. The method contemplates a planar spiral inductor structure fabricated in accord with the method. A planar spiral inductor structure fabricated in accord with the method is characterized by an enhanced Q value of the planar spiral inductor structure.
REFERENCES:
patent: 4016519 (1977-04-01), Haas
patent: 4187485 (1980-02-01), Wollnik
patent: 4219854 (1980-08-01), Church et al.
patent: 4295173 (1981-10-01), Romankiw et al.
patent: 4392013 (1983-07-01), Ohmura et al.
patent: 4613843 (1986-09-01), Esper et al.
patent: 4685014 (1987-08-01), Hanazono et al.
patent: 5834825 (1998-11-01), Imai
patent: 5844451 (1998-12-01), Murphy
patent: 6-120035 (1994-04-01), None
Ho Yen-Shih
Hsu Hun-Ming
Taiwan Semiconductor Manufacturing Co. Ltd.
Tugbang A. Dexter
Tung & Associates
LandOfFree
Method of fabricating a planar spiral inductor structure... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating a planar spiral inductor structure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a planar spiral inductor structure... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3910687