Method of fabricating a package with substantially vertical...

Details Method of fabricating a package with substantially vertical... Method of fabricating a package with substantially vertical...

2006-08-29

2006-08-29

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C438S459000

Reexamination Certificate

active

07098117

ABSTRACT:
A vacuum or hermetic packaged micromachined or MEMS device and methods for manufacturing the device so that the device has at least one substantially vertical feedthrough are provided. In a first embodiment, the method includes: providing a MEMS device fabricated on a first side of a substrate and located within a vacuum or hermetic cavity; forming at least one hole completely through the substrate between first and second sides of the substrate after the step of providing; and forming a path of electrically conductive material connecting the MEMS device and the second side of the substrate through the at least one hole to form the at least one substantially vertical feedthrough.

REFERENCES:
patent: 4261086 (1981-04-01), Giachino et al.
patent: 4277814 (1981-07-01), Giachino et al.
patent: 4386453 (1983-06-01), Giachino et al.
patent: 4815472 (1989-03-01), Wise et al.
patent: 5377524 (1995-01-01), Wise et al.
patent: 5837562 (1998-11-01), Cho
patent: 6225145 (2001-05-01), Choi et al.
patent: 6338284 (2002-01-01), Najafi et al.
patent: 6384353 (2002-05-01), Huang et al.
patent: 6512300 (2003-01-01), Cheever et al.
patent: 6633079 (2003-10-01), Cheever et al.
patent: 6806557 (2004-10-01), Ding
patent: 6809412 (2004-10-01), Tourino et al.
patent: 6815739 (2004-11-01), Huff et al.
patent: 6878566 (2005-04-01), Caplet
patent: 6894358 (2005-05-01), Leib et al.
patent: 6969630 (2005-11-01), Ozgur
patent: 2004/0027218 (2004-02-01), Stafford et al.
patent: 024945 (1980-09-01), None
patent: 1 228 998 (2002-08-01), None

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