Method of fabricating a package for a micro component

Details Method of fabricating a package for a micro component Method of fabricating a package for a micro component

2005-03-17

2009-06-30

Richards, N Drew (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S455000, C438S456000, C438S459000

Reexamination Certificate

active

07553695

ABSTRACT:
Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch process. The package may include hermetically sealed feed-through electrical connections coupling the micro component to electrical contacts on an exterior surface of the package.

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