Method of fabricating a multilayer wiring board proximity...

Electricity: measuring and testing – Magnetic – Displacement

Reexamination Certificate

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C324S253000, C029S592100, C029S606000, C029S609000, C336S200000

Reexamination Certificate

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11001215

ABSTRACT:
A method of fabricating a multilayer wiring board proximity sensor includes forming a laminate, and fabricating a plurality of through-conductors through the layers of the laminate. The laminate has a plurality of layers including one or more core layers and a plurality of coil layers. Each core layer includes a core pattern formed of a permeable material, and each coil layer comprises at least one coil trace formed of a conducting material. Thus, the through-conductors may be fabricated through the layers of the laminate such that the coil traces are interconnected by the through-conductors to thereby form one or more coils disposed about at least a portion of the core patterns of the core layers.

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