Electricity: measuring and testing – Magnetic – Displacement
Reexamination Certificate
2007-09-18
2007-09-18
Patidar, Jay M. (Department: 2862)
Electricity: measuring and testing
Magnetic
Displacement
C324S253000, C029S592100, C029S606000, C029S609000, C336S200000
Reexamination Certificate
active
11001215
ABSTRACT:
A method of fabricating a multilayer wiring board proximity sensor includes forming a laminate, and fabricating a plurality of through-conductors through the layers of the laminate. The laminate has a plurality of layers including one or more core layers and a plurality of coil layers. Each core layer includes a core pattern formed of a permeable material, and each coil layer comprises at least one coil trace formed of a conducting material. Thus, the through-conductors may be fabricated through the layers of the laminate such that the coil traces are interconnected by the through-conductors to thereby form one or more coils disposed about at least a portion of the core patterns of the core layers.
REFERENCES:
patent: 3743853 (1973-07-01), Dittman et al.
patent: 4122708 (1978-10-01), Maier
patent: 4387339 (1983-06-01), Akerblom
patent: 4950986 (1990-08-01), Guerrero
patent: 5012206 (1991-04-01), Tigges
patent: 5149962 (1992-09-01), Maurice
patent: 5334831 (1994-08-01), Maurice
patent: 5767672 (1998-06-01), Guichard et al.
patent: 6424145 (2002-07-01), Woolsey et al.
patent: 6747450 (2004-06-01), Kang et al.
patent: 6753682 (2004-06-01), Kang et al.
patent: 6759845 (2004-07-01), Kang et al.
patent: 0 232 243 (1987-08-01), None
patent: 1128883 (1968-10-01), None
patent: 1224208 (1971-03-01), None
patent: WO 01/65695 (2001-09-01), None
Notice of Opposition to a European Patent, Patent No. 1264404, Appl. No. 01914594.5; Aug. 2003; available at <http://ofi.epoline.org/view/GetDossier> (visited Sep. 27, 2004).
LaClair Robert Downing
Maier Lawrence Carl
Ringer Anthony Dean
Alston & Bird LLP
Patidar Jay M.
Simmonds Precision Products Inc.
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