Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-05-15
2008-09-16
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S455000, C438S712000, C438S508000
Reexamination Certificate
active
07425465
ABSTRACT:
Micromechanical devices having complex multilayer structures and techniques for forming the devices are described.
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International Search Report and Written Opinion of the International Searching Authority, International Application Serial No. PCT/US07/68990, Nov. 2, 2007, 6 pp.
Chambliss Alonzo
Fish & Richardson P.C.
FUJIFILM Diamatix, Inc.
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