Method of fabricating a multi-post structures on a substrate

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

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C438S455000, C438S712000, C438S508000

Reexamination Certificate

active

11383437

ABSTRACT:
Micromechanical devices having complex multilayer structures and techniques for forming the devices are described.

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International Search Report and Written Opinion of the International Searching Authority, International Application Serial No. PCT/US07/68990, Nov. 2, 2007, 6 pp.

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