Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-09-16
2008-09-16
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S455000, C438S712000, C438S508000
Reexamination Certificate
active
11383437
ABSTRACT:
Micromechanical devices having complex multilayer structures and techniques for forming the devices are described.
REFERENCES:
patent: 5376204 (1994-12-01), Amano
patent: 6049308 (2000-04-01), Hietala et al.
patent: 6436853 (2002-08-01), Lin
patent: 6534381 (2003-03-01), Cheung
patent: 6544863 (2003-04-01), Chong et al.
patent: 6841861 (2005-01-01), Brady
patent: 6984571 (2006-01-01), Enquist
patent: 2003/0076386 (2003-04-01), Tamahashi et al.
patent: 2003/0081073 (2003-05-01), Chen et al.
patent: 2004/0087109 (2004-05-01), McCann et al.
patent: 2005/0161795 (2005-07-01), Tong et al.
patent: 2008/0026230 (2008-01-01), Nevin et al.
patent: 1 321 294 (2003-06-01), None
patent: 2004-209724 (2004-07-01), None
International Search Report and Written Opinion of the International Searching Authority, International Application Serial No. PCT/US07/68990, Nov. 2, 2007, 6 pp.
Chambliss Alonzo
Fish & Richardson P.C.
FUJIFILM Diamatix, Inc.
LandOfFree
Method of fabricating a multi-post structures on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating a multi-post structures on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a multi-post structures on a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3956814