Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-12-29
1998-08-11
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 8912, 156246, 156249, 156252, 156267, 29851, B32B 3126, C04B 3564
Patent
active
057922934
ABSTRACT:
A method of fabricating a ceramic multi-layered wiring substrate, in which deformation of ceramic green sheets is prevented so that the probability of connection failure of through-holes is reduced, includes forming a ceramic green sheet on a carrier film and forming through-holes through the ceramic green sheet and the carrier film. The carrier film is used as a mask when the through-holes are filled with electrically conductive paste. The green sheet is attached onto a thick plate. The green sheets attached on the respective thick plates are sequentially adhered and laminated temporarily. The laminated green sheets form a ceramic green sheet lamination block which is sintered, resulting in a ceramic multi-layered wiring substrate.
REFERENCES:
patent: 5271150 (1993-12-01), Inasaka
patent: 5274916 (1994-01-01), Kawabata et al.
patent: 5300163 (1994-04-01), Ohtaki
patent: 5316602 (1994-05-01), Kogame et al.
patent: 5480503 (1996-01-01), Casey et al.
"High-Speed Computer Packaging with Multilayer Glass Ceramic Substrate"; Yuzo Shimada et al.; NEC Research and Development, vol. 34, No. 3, Jul. 1993; pp. 303-313.
Mayes Curtis
NEC Corporation
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