Method of fabricating a multi-die semiconductor package...

Details Method of fabricating a multi-die semiconductor package... Method of fabricating a multi-die semiconductor package...

2007-01-23

2007-01-23

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S119000, C438S108000

Reexamination Certificate

active

08602503

ABSTRACT:
An apparatus and method for increasing integrated circuit density comprising an upper die and a lower die, the latter preferably a flip chip, which are connected to a conductor-carrying substrate or a leadframe. The upper die is attached back-to-back to the lower die with a layer of adhesive applied over the back side of the lower die. Bond wires or TAB leads are attached between bond pads on the upper die and corresponding conductive trace or lead ends on the substrate. The upper die may be smaller than the lower die such that a small discrete component such as a resistor, capacitor, or the like can be attached to the adhesive not covered by the upper die. Bond wires can be attached between the upper die and the component, as well as between the component and the substrate. One or more additional die may be stacked on the upper die and electrically connected to the substrate. Furthermore, multiple lower dice can be arranged on the substrate to support upper dice bridged between the lower dice.

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