Method of fabricating a molded semiconductor device having block

Details Method of fabricating a molded semiconductor device having block Method of fabricating a molded semiconductor device having block

1993-12-02

1996-06-11

Fourson, George

Fishing, trapping, and vermin destroying

437215, 437217, 437220, 437974, 156230, 257671, H01L 2156

Patent

active

055255477

ABSTRACT:
A molded semiconductor device has a plurality of slender leads formed with a sealing strip connecting them together to prevent the molding material from leaking out between the leads. Specifically, the sealing strip comprising an adhesive and an electrically insulating material is applied to the leads substantially perpendicular to the lengthwise direction of the leads. The strip is place such that an inner edge thereof substantially lies on a boundary line or inside where the molding terminates. The strip is then thrust into spaces formed between the leads. Thereafter the semiconductor chip is connected to the leads, the semiconductor chip and the leads are placed in a molding unit, the strip serving to block the molding material leaking outside the molding unit.

REFERENCES:
patent: 3762039 (1973-10-01), Douglass et al.
patent: 3999285 (1976-12-01), Lewis et al.
patent: 5064706 (1991-11-01), Ueda et al.
patent: 5106784 (1992-04-01), Bednarz
patent: 5242725 (1993-09-01), Weissmann et al.
patent: 5281851 (1994-01-01), Mills et al.

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