Method of fabricating a microelectronic device utilizing unfille

Details Method of fabricating a microelectronic device utilizing unfille Method of fabricating a microelectronic device utilizing unfille

1978-12-04

1980-06-24

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29589, 156295, 156330, H01L 21603

Patent

active

042093589

ABSTRACT:
A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.

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Moore, "Epoxy . . . Head" Western Electric Technical Digest, No. 50 (4/78), pp. 15-16.
"Epoxy-Bonding . . . Conductivity" Design News, Sep. 19, 1977.
Kulesza, "Where Epoxy . . . Today" Insulation/Circuits, (11/74), pp. 31-33.

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