Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-02-13
2007-02-13
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S002000, C216S041000, C438S021000, C029S890100, C347S054000, C347S056000
Reexamination Certificate
active
11281446
ABSTRACT:
A method of fabricating a micro-electromechanical device includes the step of forming electrical connections to drive circuitry on a wafer substrate. A first sacrificial structure is formed on the wafer substrate. The first sacrificial structure corresponds at least to a mechanical arm to be formed on the sacrificial structure, spaced from the wafer substrate. At least the mechanical arm is formed on the sacrificial structure. A second sacrificial structure is formed on the wafer substrate such that the second sacrificial structure corresponds at least to a heater element to be connected to the electrical connections, isolated from and overlying the mechanical arm. The heater element is formed on the second sacrificial structure. A third sacrificial structure is formed on the wafer substrate such that the third sacrificial structure corresponds at least to a structural formation that serves to fasten the heater element to the mechanical arm at a position spaced from the electrical connections such that resistive heating and subsequent cooling of the heater element as a result of an electrical current passing through the heater element results in displacement of the structural formation relative to the substrate. The structural formation is formed on the wafer substrate.
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Ahmed Shamim
Silverbrook Research Pty Ltd
LandOfFree
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