Method of fabricating a lateral metal-insulator-metal device com

Metal working – Barrier layer or semiconductor device making

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29 2502, 437 41, 437181, 437229, H01L 2168

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active

052464687

ABSTRACT:
The invention is concerned with a production process for a lateral metal-insulator-metal (MIM) device for use in liquid crystal displays. A conductive pattern is formed on a transparent substrate, followed by formation of a barrier layer insulator on top of the conductive pattern. Positive photoresist is applied and light is passed through the back side of the substrate. The photoresist is developed and the barrier layer insulator is etched until the sides of the conductive pattern are exposed. A thin insulator layer is formed on the exposed sides. The lateral MIM structure is completed with the formation of a second conductive layer, or electrode, over the thin insulator. With the method of this invention, breakage of the electrode does not occur because the underlying conductor is not undercut from etching, as occurs in prior art MIM production processes.

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1988 International Display Research Conference, Oct. 1988, pp. 226-229; R. L. Wisnieff et al.: A Lift-Off Process to Build Edge Junction MIM Active Device Arrays.
S. Morozumi et al.: `A 240.times.250 element LCD Addressed by Lateral MIM` pp. 404-407, Japan Display, 1983.

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