Method of fabricating a laser diode that includes thermally...

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Compound semiconductor

Reexamination Certificate

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C438S905000

Reexamination Certificate

active

11000895

ABSTRACT:
Provided is a method of fabricating a laser diode including a lower Al-containing semiconductor material layer, a active layer, and an upper Al-containing semiconductor material layer. The method includes thermally cleaning the inside of a deposition reactor in which a substrate on which the lower Al-containing semiconductor material layer is stacked is loaded. During the thermal cleaning process, the inside of the deposition reactor is thermally treated at a predetermined temperature in an atmosphere of a gas mixture of AsH3and H2that is injected into the deposition reactor.

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Masahiko Kondow et al., “GaInNAs: A Novel Material for Long-Wavelength-Range Laser Diodes with Excellent High-Temperature Performance”, Jpn. J. Appl. Phys. vol. 35 (1996) pp. 1273-1275, Part 1, No. 2B, Feb. 1996.
Tetsuya Takeuchi et al., “Al Contamination in InGaAsN Quantum Wells Grown by Metalorganic Chemical Vapor Deposition and 1.3 μm InGaAsN Vertical Cavity Surface Emitting Lasers”, Japanese Journal of Applied Physics, vol. 43, No. 4A, 2004, pp. 1260-1263, 2004 The Japan Society of Applied Physics.

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