Method of fabricating a laminated substrate assembly chips-first

Details Method of fabricating a laminated substrate assembly chips-first Method of fabricating a laminated substrate assembly chips-first

1995-04-18

1996-10-15

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29836, 29847, H05K 330

Patent

active

055641814

ABSTRACT:
A laminated substrate assembly chip first multichip module and a method of making it includes a plurality of electronic components thinned to a predetermined thickness and mounting them on a fiat substrate in a precise position and orientation; a mechanical spacer layer including a cured film and an adhesive bonded to the flat surface of the substrate surrounding the components; the mechanical spacer layer having a thickness approximately equal to the predetermined thickness of the components and a pattern of holes in it corresponding with the precise position and orientation of the components mounted on the substrate; and a cover layer bonded over the mechanical layer and the tops of the components.

REFERENCES:
patent: 4216577 (1980-08-01), Badet et al.
patent: 4635356 (1987-01-01), Ohuchi et al.
patent: 4668314 (1987-05-01), Endoh et al.
patent: 5192682 (1993-03-01), Kodai et al.
patent: 5365656 (1994-11-01), Dahringer et al.
IBM Techical Disclosure Bulletin, vol. 11, No. 8, Jan. 1969, p. 971.

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