Method of fabricating a hybrid printed circuit board

Details Method of fabricating a hybrid printed circuit board Method of fabricating a hybrid printed circuit board

1997-10-29

2000-01-18

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29846, 216 13, 216 17, 216 18, 216 41, 427 58, 427256, 427282, 427331, H01K 310

Patent

active

060148055

ABSTRACT:
A method of fabricating a hybrid printed circuit board on a dielectric substrate is disclosed. The method comprises the step of masking a first pattern on a first side of the dielectric substrate, and masking a second side of the dielectric layer. Subsequently, the first side of the dielectric layer is etched to form a first conductive pattern. Thereafter, a second pattern is masked on the second side of the dielectric substrate, while masking the first side of the dielectric layer. With the second pattern masked on the second side of the dielectric layer and the and the first side masked, an etching step if performed on the second side of the dielectric layer to form a second conductive pattern.

REFERENCES:
patent: 4569720 (1986-02-01), Schmitkons et al.
patent: 5089361 (1992-02-01), Huang
patent: 5389270 (1995-02-01), Thorn et al.
patent: 5603848 (1997-02-01), Beratan et al.
patent: 5676855 (1997-10-01), Schulz-Harder
patent: 5718039 (1998-02-01), Saida et al.

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