Method of fabricating a hollow filament separator module

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156166, 156169, 156250, 156296, 210321R, 264 71, 264138, 264261, B65H 8100, B32B 108

Patent

active

042204895

ABSTRACT:
A hollow filament separatory module utilizing an annulus of semi-permeable hollow filaments with open ends encased in a potting compound and a collection chamber communicating with said open ends adjacent the potting compound with access surface means formed in the potting compound wherein the open ends appear, said filaments having ends thereof encapsulated by the introduction of potting medium into the interfilament interstices under the urging of vibratory energy and thereafter creating said open ends by cutting of ends and potting medium at a time in the curring cycle of the potting compound prior to its final cure.

REFERENCES:
patent: 3236710 (1966-02-01), Curtiss
patent: 3769127 (1973-10-01), Goldsworthy et al.
patent: 3825639 (1974-07-01), Bulin
patent: 4038190 (1977-07-01), Baudet et al.
patent: 4105731 (1978-09-01), Yamazaki
patent: 4123304 (1978-10-01), Gaudette

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