Method of fabricating a high current package with multi-level le

Details Method of fabricating a high current package with multi-level le Method of fabricating a high current package with multi-level le

1985-01-17

1986-05-20

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29589, 29591, H01L 2334, H01L 2312, H01L 2348

Patent

active

045891958

ABSTRACT:
An improved high power semiconductor device and manufacturing method are described wherein one or more die are assembled to one electrode having a heat transfer face and additional insulated electrodes, said electrode having bent up and bent over portions forming high current terminals and control terminals such that the current terminals and control terminals lie in different planes and such that terminal spacings satisfy Underwriters Laboratory recommendations. The die and electrode assembly is partly encapsulated preferably in plastic. The current terminals are diagonally located to facilitate use of standard bus bar arrangements with different device orientations. Connection nuts are movably retained to limit transfer of tightening torque to the plastic body. Choices of materials are described.

REFERENCES:
patent: 3992790 (1976-11-01), Myers
patent: 3999280 (1976-12-01), Hansen et al.
patent: 4160308 (1979-07-01), Courtney et al.
patent: 4510677 (1985-04-01), Collumeau
patent: 4518982 (1985-05-01), Du Bois et al.

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