Method of fabricating a heat exchanger for solid-state electroni

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making

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2989004, 165 804, B23P 1526

Patent

active

052749207

ABSTRACT:
A microscopic laminar-flow heat exchanger, well-suited for cooling a heat generating device such as a semiconductor integrated circuit, includes a plurality of thin plates, laminated together to form a block. Each plate has a microscopic recessed portion etched into one face of the plate and a pair of holes cut through the plate such that when the block is formed, the holes align to form a pair of coolant distribution manifolds. The manifolds are connected via the plurality of microscopic channels formed from the recessed portions during the lamination process. Coolant flow through these channels effectuates heat removal.

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