Method of fabricating a freestanding semiconductor connection

Details Method of fabricating a freestanding semiconductor connection Method of fabricating a freestanding semiconductor connection

1985-06-10

1987-10-27

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29843, H05K 320

Patent

active

047020032

ABSTRACT:
A method is disclosed for bonding a minute semiconductor device to the freestanding end of a flexible microcircuit. The method generally comprises a series of steps including initially bonding the semiconductor device to a substrate for handling during the further progression of steps. An extremely minute conductive ball is bonded to one or more conductive surfaces of the semiconductor device and an upwardly depending pigtail is formed atop each of the conductive balls. The flexible microcircuit, having holes in predetermined locations and in numbers corresponding to the upwardly depending pigtails, is positioned atop those pigtails such that a portion of each pigtail protrudes through the flexible microcircuit. Another minute conductive ball is thereafter applied to each of those portions of pigtails protruding through the flexible microcircuit, thus sandwiching the microcircuit between the conductive balls. The final result is a semiconductor device attached to the distal, free end of the flexible microcircuit of sufficient minuteness such that the semiconductor and distal end of the microcircuit can be inserted into a patient's blood vessel for in vivo detection and monitoring of various parameters.

REFERENCES:
patent: 3330026 (1967-07-01), Best et al.
patent: 4268956 (1981-05-01), Parks et al.
patent: 4438561 (1984-03-01), Mueller

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