Method of fabricating a fluid drop ejector

Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead

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298901, 347 1, 347 68, 347 71, 347 29, 347 9, 347 3, 205 75, 346 11, 346140R, H01L 2100

Patent

active

061271985

ABSTRACT:
The silicon fluid ejector of the present invention includes an electrostatically actuated micromachined positive displacement mechanism consisting of a piston, piston containment structure, piston retraction mechanism and an ejection orifice. These features provide for very low cost of production, high reliability and "on demand" drop size, modulation. The fluid ejector mechanism can be easily produced via monolithic batch fabrication based on the common production technique of surface micromachining.

REFERENCES:
patent: 5087930 (1992-02-01), Roy et al.
patent: 5463411 (1995-10-01), Wehl
patent: 5506608 (1996-04-01), Marler et al.
patent: 5565113 (1996-10-01), Hadimioglu et al.
patent: 5581861 (1996-12-01), Lee et al.
patent: 5685491 (1997-11-01), Marks et al.
patent: 5929875 (1999-07-01), Su et al.

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