Method of fabricating a flip chip mold injected package

Details Method of fabricating a flip chip mold injected package Method of fabricating a flip chip mold injected package

1999-02-01

2000-07-04

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438127, 156382, H01L 2144

Patent

active

060837748

ABSTRACT:
When a semiconductor chip is mounted on a circuit substrate, the space therebetween can be briefly sealed with a resin encapsulant by transfer molding an encapsulating resin composition in molten state and under pressure into the space and heat curing the composition thereat. The composition contains (a) an epoxy resin, (b) a curing agent, and (c) an inorganic filler having a maximum particle size of up to 24 .mu.m and has a melt viscosity of up to 200 poises at the molding temperature. Then encapsulation can be completed within a very short cycle without allowing the filler to settle. Semiconductor devices are manufactured to high reliability.

REFERENCES:
patent: 4999699 (1991-03-01), Christie
patent: 5089440 (1992-02-01), Christie
patent: 5292688 (1994-03-01), Hsiao
patent: 5912320 (1999-06-01), Hotta
patent: 5928595 (1999-07-01), Knapp

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