Method of fabricating a flexible organic integrated circuit

Details Method of fabricating a flexible organic integrated circuit Method of fabricating a flexible organic integrated circuit

2006-04-24

2008-11-18

Louie, Wai-Sing (Department: 2814)

Semiconductor device manufacturing: process

Having organic semiconductive component

C438S082000, C257SE51001

Reexamination Certificate

active

07452746

ABSTRACT:
Method of making an organic flexible integrated circuit includes providing a rigid substrate, such as a silicon wafer, and providing alternating layers of thin film conductors and dielectrics to thus yield interconnect layers including a flexible substrate on the rigid substrate to yield a high density interconnect. Further, the method includes fabricating an organic transistor, and connecting the organic transistor to the high density interconnect to form an organic integrated circuit including the flexible substrate. Then, the rigid substrate and the flexible substrate may be attached to a support. The integrated circuit attached to the rigid and flexible substrates may be tested prior to this attachment. Then the rigid substrate may be removed from the flexible substrate, such as by a destructive. The integrated circuit may be tested gain at this point. The organic integrated circuit may then be released from the support to yield a flexible integrated circuit.

REFERENCES:
patent: 7005179 (2006-02-01), Davidson et al.
patent: 2004/0266207 (2004-12-01), Sirringhauss et al.
patent: 2006/0148167 (2006-07-01), Brown et al.

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