Metal fusion bonding – Process – Plural joints
Patent
1974-11-20
1977-03-08
Smith, Al Lawrence
Metal fusion bonding
Process
Plural joints
228193, 228234, 228263, 291914, 29195, 29197, B23K 2800
Patent
active
040108848
ABSTRACT:
A filament-reinforced composite article is fabricated from monolayer boron fiber tapes and laminates of titanium. The tapes which have the boron fibers attached to an aluminum foil are positioned in a multi-ply layup with interleaved titanium laminates in the form of foils or screening. The layup is subjected to heat and pressure in a diffusion bonding process to compact the layup materials and bond the fibers in the matrix of aluminum and titanium. The titanium in the matrix improves the impact load resistance of the article by improving ductility and impact strength.
REFERENCES:
patent: 3218704 (1965-11-01), Kraus et al.
patent: 3575783 (1971-04-01), Kreider
patent: 3699623 (1972-10-01), Kreider
patent: 3748721 (1973-07-01), Alexander
Garret et al. Broad Applications of Diffusion Bonding, NASA CR-409, Wash. D.C., 1966, pp. 177 and 162.
Niemann, J. T. and Garrett, "Eutectic Bonding of Boron-Aluminum Structural Components", 54th AWS Annual Meeting, Chicago, Ill., Apr. 2-6, 1973. Published in the Welding Journal Research Supplements: (Part I), Apr. 1974, pp. 175s-184s, and (Part II), Aug. 1974, pp. 351s-360s.
Broutman & Krock, Composite Materials, vol. IV, Metallic Matrix Materials, edited by Kreider, Academic Press, NY, 1974, pp. 420-421.
Del Ponti John D.
Ramsey K. J.
Smith Al Lawrence
United Technologies Corporation
LandOfFree
Method of fabricating a filament-reinforced composite article does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating a filament-reinforced composite article, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a filament-reinforced composite article will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1402423