Method of fabricating a field emission micro-tip

Details Method of fabricating a field emission micro-tip Method of fabricating a field emission micro-tip

1995-07-31

1996-12-03

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating an article whose final configuration has...

313309, 313310, 445 50, 216100, 216102, H01J 130

Patent

active

055804675

ABSTRACT:
A method of fabricating a field emission micro-tip which can emit electrons uniformly and can be fabricated at a high yield when applied to a large device. The micro-tip is fabricated such that when the adhesive layer and mask are instantaneously etched the tungsten micro-tips are lifted upwardly due to the differences in internal stress and etching rates of the tungsten cathode, the lower adhesive layer and the upper mask layer. The sharpness of the micro-tip is easily adjusted depending on the shape of the micro-tip. Also, since the internal stress of tungsten and characteristics of the BOE method are utilized throughout the fabricating process, the reproducibility is ensured. Moreover, since multiple tips are fabricated, the output current can be manipulated in a wide range of nanoamperes to milliamperes. Since tungsten is used for fabricating the micro-tips, excellent properties are obtained with regard to strength, oxidation, work function, and electrical, chemical and mechanical durability.

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patent: 5378963 (1995-01-01), Ikeda
patent: 5386172 (1995-01-01), Komatsu

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