Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-01-31
2006-01-31
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S714000, C257S715000, C257S784000, C361S689000, C361S699000
Reexamination Certificate
active
06991968
ABSTRACT:
A device and method for cooling a hot spot are provided. The cooling device for cooling a micro hot spot includes a first substrate, a first channel formed on the first substrate and having two narrowed ends, a second channel formed on the first substrate and connected to the first channel, a cooling fluid injected into the first channel and the second channel, a second substrate connected to the first substrate and having the micro hot spot disposed thereon, two of wires disposed at the narrowed ends of the first channel, and a power supply for providing a pulse current to the wires, thereby micro bubbles being produced around the wires.
REFERENCES:
patent: 2004/0104022 (2004-06-01), Kenny et al.
patent: 2005/0046017 (2005-03-01), Dangelo
patent: 2005/0139996 (2005-06-01), Myers et al.
patent: 469613 (2001-12-01), None
Kwang-Seok Yun et al., “A Micropump Driven by Continous Electrowetting Acutation for Low Voltage and Low Power Operations”, IEEE, 2001 pp. 487-490.
Chambliss Alonzo
Oriental Institute of Technology
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