Method of fabricating a coplanar, self-aligned contact structure

Fishing – trapping – and vermin destroying

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437192, 437193, 437195, 437200, 437228, H01L 21283, H01L 21285, H01L 2176

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049944029

ABSTRACT:
A method of fabricating a coplanar, self-aligned contact structure in a semiconductor device. Polysilicon pads are placed on top of field oxide regions which adjoin source and drain diffusion regions of the device. Strips of highly conductive material such as titanium silicide or titanium nitride are formed on top of each pad; each strip extends down a side of its pad to an adjoining diffusion region, thereby establishing a conductive path between the diffusion region and the top of the pad. Contacts are established by etching holes through a passivation layer which covers the device to reach the conductive strips on top of the pads.

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