Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-10-10
2006-10-10
Everhart, Caridad (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S680000, C257S706000, C977S735000
Reexamination Certificate
active
07118941
ABSTRACT:
A composite carbon nanotube structure including a number of carbon nanotubes disposed in a metal matrix. The composite carbon nanotube structure may be used as a thermal interface device in a packaged integrated circuit device.
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U.S. Appl. No. 10/607,525, filed Jun. 25, 2003, Valery M. Dubin, Pending.
Dubin Valery M.
Garner C. Michael
Zhang Yuegang
Everhart Caridad
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