Method of fabricating a circuit board

Details Method of fabricating a circuit board Method of fabricating a circuit board

1988-06-06

1989-08-15

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29846, H01K 310

Patent

active

048561843

ABSTRACT:
A circuit board is fabricated from a substrate of dielectric material having at least one run of conductive material adhered to one surface thereof. A second substrate of dielectric material is bonded to the one surface of the first substrate so as to cover the run of conductive material. A hole is formed through the first and second substrates and intercepts the run of conductive material. Conductive material is introduced into the hole and establishes electrically conductive contact with the run of conductive material. The diameter of the hole is at least as great as the width of the run of conductive material where it is intercepted by the hole.

REFERENCES:
patent: 4788766 (1988-12-01), Burger et al.

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