Method of fabricating a brazed glass pre-passivated chip rectifi

Details Method of fabricating a brazed glass pre-passivated chip rectifi Method of fabricating a brazed glass pre-passivated chip rectifi

1988-02-01

1990-07-17

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437135, 437180, 427229, 174 94R, 357 67, H01L 300

Patent

active

049421395

ABSTRACT:
A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high temperature brazing of contact members to the die. Etching of the die, plus unavoidable etching of the contact members, is conducted without contamination of the junction area.

REFERENCES:
patent: 3198999 (1965-08-01), Baker et al.
patent: 3743538 (1973-07-01), Mungaard
patent: 3801880 (1974-04-01), Harada et al.
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3871014 (1975-03-01), King et al.
patent: 3871016 (1975-03-01), Lin et al.
patent: 3940847 (1976-03-01), Park et al.

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