Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1998-05-04
1999-12-07
Chaudhari, Chandra
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
257714, H01L 2144
Patent
active
059982403
ABSTRACT:
Cooling of densely packaged semiconductor devices is achieved by microchannels which extract heat by forced convection and the use of fluid coolant located as close as possible to the heat source. The microchannels maximize heat sink surface area and provides improved heat transfer coefficients, thereby allowing a higher power density of semiconductor devices without increasing junction temperature or decreasing reliability. In its preferred embodiment, a plurality of microchannels are formed directly in the substrate portion of a silicon or silicon carbide chip or die mounted on a ground plane element of a circuit board and where a liquid coolant is fed to and from the microchannels through the ground plane. The microchannels comprise a plurality of closed-ended slots or grooves of generally rectangular cross section. Fabrication methods include deposition and etching, lift-off processing, micromachining and laser cutting techniques.
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Arlow Gregory A.
Baker Martin L.
Fagan, Jr. Thomas J.
Golombeck John C.
Hamilton Robin E.
Chaudhari Chandra
Northrop Grumman Corporation
Sulsky Martin
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