Method of evaluating silicon wafers

Details Method of evaluating silicon wafers Method of evaluating silicon wafers

1995-09-14

1996-07-09

Noland, Thomas P.

Measuring and testing

Surface and cutting edge testing

Roughness

364507, 364561, G01B 734

Patent

active

055333877

ABSTRACT:
The height x.sub.i (i=1, 2, . . . , N) of a plurality of measuring points on a silicon wafer from a reference plane is measured by means of an AFM (atomic force microscope), the autocorrelation function R.sub.j represented by the equation below is determined: ##EQU1## Where x denotes: ##EQU2## is determined, an arbitrary number of autocorrelation function R.sub.j with large value from said autocorrelation function R.sub.j are selected, and the microroughness on said silicon wafer is analyzed based on the distances between the point R.sub.j=0 and said selected points R.sub.j 's with large value except for R.sub.j=0.

REFERENCES:
patent: 5418363 (1995-05-01), Elings et al.
patent: 5476006 (1995-12-01), Fujii et al.
patent: 5497656 (1996-03-01), Kado et al.

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