Method of etching, refilling and etching dielectric grooves for

Details Method of etching, refilling and etching dielectric grooves for Method of etching, refilling and etching dielectric grooves for

1981-07-13

1983-07-19

Roy, Upendra

Metal treatment

Process of modifying or maintaining internal physical...

Chemical-heat removing or burning of metal

29571, 148 15, 156648, H01L 2176, H01L 2700

Patent

active

043941966

ABSTRACT:
A method for manufacturing a semiconductor device comprising: (a) a step of forming at least one groove(s) at the predetermined portion(s) of a semiconductor substrate; (b) a step of depositing insulating material with a thickness larger than half the opening width of the groove on the whole surface of the semiconductor substrate including the groove to fill the groove with insulating material; and (c) a step of etching the insulating material layer by the thickness thereof on the semiconductor substrate excluding the groove to form a field region consisting of insulating material left at least in the groove.

REFERENCES:
patent: 4104086 (1978-08-01), Bondur et al.
patent: 4139442 (1979-02-01), Bondur et al.
patent: 4140558 (1979-02-01), Murphy et al.
patent: 4209349 (1980-06-01), Ho et al.
patent: 4209350 (1980-06-01), Ho et al.
patent: 4211582 (1980-07-01), Horng et al.
patent: 4252582 (1981-02-01), Anantha et al.
patent: 4255207 (1981-03-01), Nicolay et al.
patent: 4264382 (1981-04-01), Anantha et al.
patent: 4274909 (1981-06-01), Venkataraman et al.
patent: 4318751 (1982-03-01), Horng

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