Method of etching non-doped polysilicon

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface...

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205674, 438745, 438753, H01L 2100

Patent

active

061325929

ABSTRACT:
A semiconductor device having a non-doped polysilicon and a doped polysilicon containing group III element is selectively wet-etched the non-doped polysilicon by using an etching liquid. The etching liquid is an electrolytic liquid obtained on a side of a cathode electrode and the electrolytic liquid is formed by electrolyzing a liquid containing pure water added with ammonium ion.

REFERENCES:
patent: 2998362 (1961-08-01), Hall
patent: 3730800 (1973-05-01), Nakashima

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