Method of etching materials containing silicon

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 17, 252 792, H01L 21318, C09K 1304

Patent

active

039716830

ABSTRACT:
The invention relates to a method of etching solid, chemically resistant materials containing silicon (Si) by means of a hot melt made up of Society phosphorus pentoxide (P.sub.2 O.sub.5) and phosphoric acid (H.sub.3 PO.sub.4) (anhydrous).

REFERENCES:
patent: 3715249 (1973-02-01), Panousis et al.
patent: 3871931 (1975-03-01), Godber
Van Gelder et al., "The Etching of Silicon Nitride in Phosphoric Acid with Silicon Dioxide as a Mask, "Journal of the Electrochemical Society," vol. 114 (1967), pp. 869-872.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of etching materials containing silicon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of etching materials containing silicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of etching materials containing silicon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1623450

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.