Method of etching copper and copper alloys

Details Method of etching copper and copper alloys Method of etching copper and copper alloys

1973-08-06

1976-01-20

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156345, C23F 100

Patent

active

039335445

ABSTRACT:
A method of etching copper and copper alloys by means of an ammoniacal etching solution containing chloride ions and for regenerating this etching solution during this etching process by adding an ammoniacal compound, for example, in the form of ammonium hydroxide or ammonia gas, as well as hydrochloric acid and water to the etching solution in accordance with continuous measurements of the pH-value and the specific gravity of the etching solution.

REFERENCES:
patent: 3216873 (1965-11-01), Jones
patent: 3466208 (1969-09-01), Slominski
patent: 3505135 (1970-04-01), Lindstrom
patent: 3717521 (1973-02-01), Slominski et al.

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