Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2006-12-05
2006-12-05
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S690000
Reexamination Certificate
active
07144749
ABSTRACT:
A method for etching windows40in a semiconductor device10having a metal fuse14embedded therein is disclosed. The method is for allowing accurate fuse blowing, in particular laser fuse blowing. The method involves the controlled removal of layers having different phase diffraction characteristics. After treatment, the remaining area between the metal fuse14and the etched surface of the semiconductor has substantially uniform phase diffraction characteristics.
REFERENCES:
patent: 6004881 (1999-12-01), Bozada et al.
patent: 6174753 (2001-01-01), Liao
patent: 6194318 (2001-02-01), Ikeda
patent: 6300252 (2001-10-01), Ying et al.
Ng Khim Hong
Pong Chin Ling
Dang Phuc T.
Rothwell Figg Ernst & Manbeck
Systems on Silicon Manufacturing Company Pte. Ltd.
LandOfFree
Method of etching a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of etching a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of etching a semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3685704