Method of etching a metallic film on a substrate

Details Method of etching a metallic film on a substrate Method of etching a metallic film on a substrate

2007-04-17

2007-04-17

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Gas phase etching of substrate

Etching inorganic substrate

C216S074000, C216S058000, C134S001100, C134S026000, C134S036000

Reexamination Certificate

active

10838275

ABSTRACT:
A method of etching a metallic film on a substrate. This method operates to inject an oxidizing agent through the use of a carrier gas to etch a source metal in the presence of a reducing agent such that the rate of etching can be controlled by controlling the flow rate of the carrier gas, the substrate temperature, the pulse widths of the oxidizing and reducing agents, and the number of etching phases.

REFERENCES:
patent: 5505322 (1996-04-01), Shinohara et al.
patent: 5993679 (1999-11-01), Koide et al.
patent: 6008140 (1999-12-01), Ye et al.
patent: 2001/0018922 (2001-09-01), Jolley

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