Method of etching a bond pad

Details Method of etching a bond pad Method of etching a bond pad

1996-07-19

1999-06-15

Nuzzolillo, Maria

Etching a substrate: processes

Gas phase etching of substrate

Etching a multiple layered substrate where the etching...

216 67, 216 77, 438612, 438634, 438636, 438637, B44C 122

Patent

active

059118873

ABSTRACT:
This invention relates to a method of etching a bond pad in a semiconductor or integrated circuit, a method of using an etching apparatus and a semiconductor device.

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