Method of estimating quantity of boron at bonding interface in b

Details Method of estimating quantity of boron at bonding interface in b Method of estimating quantity of boron at bonding interface in b

1994-09-22

1996-07-23

Fourson, George

Fishing, trapping, and vermin destroying

437974, 148DIG12, H01L 2166

Patent

active

055389040

ABSTRACT:
A method of estimating the amount of boron on the surface of silicone samples in which a plurality of reference samples shallowly ion-implanted with boron in different dosages are prepared and heat-treated under the same conditions of temperature and time as are used in a bonding heat treatment to obtain the bonded wafer, thereafter, the boron profile in the direction of the depth of the bonding interface in each reference sample is measured using a SIMS and compared with an actual boron profile at the bonding interface of a bonded wafer to be estimated so as to determine one reference sample whose boron profile is equivalent to the actual boron profile of the bonded wafer to be estimated, and finally a dosage of boron in the determined reference sample is estimated by convertion to be a surface density of boron presenting at the bonding interface of the bonded wafer to be estimated at an initial stage prior to the bonding heat treatment of the bonded wafer to be estimated. Thus, the boron profile obtained by SIMS measurement can be converted into the boron surface density with the result that the boron quantity at the bonding interface of a bonded wafer can be readily estimated to be a boron surface density.

REFERENCES:
patent: 5138256 (1992-08-01), Murphy et al.
patent: 5232870 (1993-08-01), Ito et al.
patent: 5362667 (1994-11-01), Linn et al.
patent: 5418172 (1995-05-01), Folster et al.
S. Wolf, "Silicon Processing For the VLSI Era vol. 2", Lattice Press, pp. 656-664, 668-669, (1990).
Datanbase WPIL, No. 86-179 223, Derwent Publications Ltd., London; JP-A-61 112 000 (Matsushita).

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