Method of establishing a structure of electrical interconnection

Details Method of establishing a structure of electrical interconnection Method of establishing a structure of electrical interconnection

1988-11-07

1989-07-25

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437189, 437192, 437202, 148DIG19, H01L 2100, H01L 2102, H01L 21283, H01L 21441

Patent

active

048513695

ABSTRACT:
After having formed contact islands (20) comprising at least one layer of silicide (20) of titanium or cobalt, these islands are covered by a complementary metallic layer (30) obtained by selective growth of tungsten or molybdenum, which is localized at the said islands. This complementary metallic layer especially serves as a stopping layer during etching of contact openings (33) into an isolating layer (32) supporting the remaining part of the structure of interconnections.

REFERENCES:
patent: 4107726 (1978-08-01), Schilling
patent: 4121241 (1978-10-01), Drake et al.
patent: 4507852 (1985-04-01), Karulkar
patent: 4545116 (1985-10-01), Lau
patent: 4562640 (1986-01-01), Widmann et al.
patent: 4641420 (1987-02-01), Lee
patent: 4672419 (1987-06-01), McDavid
patent: 4690730 (1987-09-01), Tang et al.
patent: 4804636 (1989-02-01), Groover, III et al.
Broadbent, E., Growth of Selective Tungsten on Self-Aligned Ti and PtNi Silicides by Low Pres. Chem. Vapor Deposition, J. Electrochem. Soc., pp. 1715-1720, vol. 133, No. 8, Aug. 1986.
Kaneko, H., Novel Submicron MOS Devices by Self-Aligned Nitridation of Silicide, pp. 208-211, IEDM 85.
Lin, M., A New Lateral Growth Free Formation Technique for Titanium Silicide Using the Si/W/Ti Trilayer Structure, J. Electrochem. Soc., pp. 2342-2346, Vol. 135, No. 9, Sep. 1988.

Affiliated with

Also associated with

Rating

Method of establishing a structure of electrical interconnection does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of establishing a structure of electrical interconnection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of establishing a structure of electrical interconnection will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2358087