Method of enveloping metal hollows with polyethylene

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

427 27, 427 32, 427185, 427195, 4274071, 427409, 427410, 156192, B05D 106, B05D 124

Patent

active

046859853

ABSTRACT:
The metal hollow is provided with a base layer of an epoxy resin being electrostatically applied upon which an ethylene copolymer powder is electrostatically applied possibly under particular inclusion of epoxy resin and possibly in several layers of varying relative consistency; after each powder application step, surface heating is applied to melt the respective powder; the final coating of polyethylene is either electrostatically applied or through suitable extrusion process. Particular grain size distribution and powder consistency patterns are suggested.

REFERENCES:
patent: 4104416 (1978-08-01), Parthasarathy
patent: 4211595 (1980-07-01), Samour
patent: 4319610 (1982-03-01), Eckner

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