Method of ensuring electrical contact between test probes and ch

Details Method of ensuring electrical contact between test probes and ch Method of ensuring electrical contact between test probes and ch

1992-10-23

1994-11-29

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324758, G01R 104

Patent

active

053693582

ABSTRACT:
A method of testing chips having each a plurality of contact pads, the chips are arranged on a semiconductor wafer or on a printed circuit and are tested with a test system having a test head provided with a plurality of probes, the method comprising the steps of: a) moving the test head and the chips towards each other by a distance which is smaller than a predefined maximum length; b) determining the presence of a contact between the probes and the contact pads by performing an electrical test via the probes to yield a predetermined electrical result; and c) repeating steps a) and b) until the electrical test no longer yields the predetermined electrical result or until the predefined maximum length is reached. The invention also provides for a test system for carrying out the inventive method.

REFERENCES:
patent: 3644829 (1972-02-01), Chan et al.
patent: 3996517 (1976-12-01), Fergason et al.
patent: 4673839 (1987-07-01), Veenendaal
patent: 4780836 (1988-10-01), Miyazaki et al.
patent: 4864227 (1989-09-01), Sato
patent: 4906920 (1990-03-01), Huff et al.
patent: 5128612 (1992-07-01), Aton et al.
W. R. Smith, "Closed-Loop Control of the Z Stage of a Wafer Prober", IBM Technical Disclosure Bulletin, vol. 26, No. 7B, Dec. 1983, p. 3579.
Takeuchi Takashi, "Wafer Prober", Patent Abstracts of Japan, vol. 011306, Jun. 10, 1987, p. 1.

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