Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-09-03
1998-06-02
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156252, 1562728, 156277, 264400, B32B 3118
Patent
active
057593310
ABSTRACT:
A ceramic slurry is deposited onto a plastic carrier tape and allowed to dry before the tape is inverted for further processing. The plastic carrier tape remains with the ceramic during subsequent via hole punching and printing steps. The carrier tape also remains with the dried ceramic to support the same when the via holes are filled with conductive material which helps retain the material within the via holes. The carrier tape is peeled off as each layer of ceramic is built up to form a laminated multi-layer ceramic component. This provides a smooth, uniform surface at the top of each conductive-filled via hole. In order to ensure that the conductive properties of each conductive-filled via are not compromised a preparatory step of creating a hole in the plastic carrier tape that is very small in comparison to the via hole placed in the ceramic tape is included. The small hole in the plastic carrier serves as a bleed hole for air trapped in the conductive paste. The conductive paste in the plastic layer is also made easier to remove because the small area of the paste in the small hole decreases its tensile strength relative to the paste in the ceramic layer. This decreased strength increases the likelihood that it will fracture under a shear stress and separate from the paste in the ceramic layer.
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Dostart Paul J.
Mayes Curtis
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