Method of encapsulating TFEL panels with a curable resin

Details Method of encapsulating TFEL panels with a curable resin Method of encapsulating TFEL panels with a curable resin

1987-10-05

1989-02-07

Ramsey, Kenneth J.

Electric lamp or space discharge component or device manufacturi

Process

With start up, flashing or aging

445 24, H05B 3304

Patent

active

048028738

ABSTRACT:
A solid filler material is used to encapsulate active TFEL components supported by a substrate and disposed within a cavity. The cavity is created by affixing a rear cover plate to the substrate. The filler material is injected into the cavity as a liquid but cures to a solid under the influence of heat. This provides an effective moisture barrier and enhances the structural integrity of the panel rendering it immune to problems caused by changes in air pressure or caused by vibration.

REFERENCES:
patent: 3213515 (1965-10-01), Koury et al.
patent: 4203792 (1980-05-01), Thompson
patent: 4213074 (1980-07-01), Kawaguchi et al.
patent: 4217014 (1980-08-01), Piascinski
patent: 4446399 (1984-05-01), Endo et al.
patent: 4447757 (1984-05-01), Kawaguchi et al.
patent: 4578617 (1986-03-01), Kerr, III et al.
patent: 4719385 (1988-01-01), Barrow et al.

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