Method of encapsulating temperature sensitive devices in wax-lik

Details Method of encapsulating temperature sensitive devices in wax-lik Method of encapsulating temperature sensitive devices in wax-lik

1993-04-13

1995-04-18

Silbaugh, Jan H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264162, 26427211, 26427212, 26427217, 2643284, 2643285, 264294, B29C 4514

Patent

active

054075050

ABSTRACT:
A method of encapsulating temperature-sensitive electronic devices such as solid state memory devices used in aircraft for recording flight data and the like in a wax-like material having a high heat of fusion to establish a heat sink for protecting the device against intense heat resulting from fire includes the preparation of a wax "preform" under heat and pressure in a closed chamber for minimizing oxidation thereof and thereafter transferring the preform by the application of heat and pressure to move the material in a softened condition into a mold cavity supporting the memory devices and forming the material to encapsulate a printed circuit board, carrying memory devices to exclude air and protect the same from deleterious effects of intense heat.

REFERENCES:
patent: 4460537 (1984-07-01), Heinle
patent: 4569814 (1986-02-01), Chong et al.
patent: 4694119 (1987-09-01), Groenewegen
patent: 4927590 (1990-05-01), Poelzing
patent: 4944401 (1990-07-01), Groenwegen

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